Categories: Semi & SMT/PCB, Bonders
Condition: Used
Seller: J.M. Industries
MEI 827
The MEI 827 hybrid ball bonder is a simple yet very efficient semi-automatic bonder for thermosonic or thermocompression bonding. Unique gravity fed/damper controlled bonding arm ensures a constant controlled impact force. The patented wire feed system with EFO ensures constant ball size independent of bonding levels.The aluminum or gold wire size it uses is .7-3 mil The weight of this machine is 60 lbs and the size is 12″ W X 18″D X 17 3/4″H.
JMI can offer full support on these machines when you purchase them here.
Used-Line Dealer since : 2000
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