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Categories: Semi & SMT/PCB, PCB Reflow Ovens
Condition: Used
Seller: TANAKA Corporation
#10837 MALCOM Reflow Simulator RDT-250C
＃10837 MALCOM Reflow Simulator RDT-250C
Applicable Circuit Board：Up to 250W x 330L x 15H mm
Outer Dimension：830W x 557D x 523H mm
Heating Method：Upper-face : Extreme infrared radiation with hot air
Lower-face : Extreme infrared radiation
Cooling Method：Exhaust damper continuous operation by flowing air or N2 air (with flow adjustable valve)
Power Supply：200V 50/60Hz 18kVA 3Phase
Air：0.3 - 0.5MPa 100 liter/min (Maximum)
Measuring Temp. Range：Room temp. - 330C
Measuring Points：1 - 6 points
Weight：Approx. 110kg
Power cable, PC, exhaust duct, blower, and oxygen analyzer are not included.
Used-Line Dealer since : 2001
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Product Specs
(From Used-Line T&M Specifications)
MALCOM RDT-250C
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