MEI 772

The MEI 772 Hybrid Epoxy Die Mounter enables mounting of a wide variety
of chips required by complex hybrid circuits without tool change. Chips
such as capacitors, diodes, IC’s and LED’s may be assembled without
changing setup, tools or dispenser.

FEATURES
Manual “Z” lever control of both tool and dispenser automatically
compensates for multi-level
bonding.
Positive viewing of dispensed dots permits various amounts of
material to be dispensed for different size chips.
Positive mechanical dispensing system produces consistent dots from .005″ to. 100″